What is Global BGA Sockets Market?
The Global BGA (Ball Grid Array) Sockets Market is a specialized segment within the electronics industry, focusing on the production and distribution of sockets used to connect BGA packages to printed circuit boards (PCBs).
0.4mm Pitch, 0.5mm Pitch, 0.65mm Pitch, Others in the Global BGA Sockets Market:
BGA sockets are crucial components in the assembly and testing of electronic devices, providing a reliable interface for integrated circuits (ICs) that use BGA packaging.
Prototyping, Validation, Testing, Others in the Global BGA Sockets Market:
These sockets are designed to accommodate the unique structure of BGA packages, which feature an array of solder balls on the underside of the IC for electrical connections.
Global BGA Sockets Market Outlook:
The market for BGA sockets is driven by the increasing demand for advanced electronic devices, such as smartphones, tablets, and other consumer electronics, which require compact and efficient packaging solutions.
| Report Metric | Details |
| Report Name | BGA Sockets Market |
| Accounted market size in year | US$ 390 million |
| Forecasted market size in 2031 | US$ 587 million |
| CAGR | 6.1% |
| Base Year | year |
| Forecasted years | 2025 - 2031 |
| by Type |
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| by Application |
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| Production by Region |
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| Consumption by Region |
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| By Company | Advanced Interconnections, Mill-Max, 3M, Andon Electronics, Preci-dip SA, Yamaichi Electronics Co, Enplas Corporation, E-tec, Plastronics, Johnstech, Loranger, Ironwood Electronics, NXP |
| Forecast units | USD million in value |
| Report coverage | Revenue and volume forecast, company share, competitive landscape, growth factors and trends |
