Global GaN Power IC Design Market Research Report 2025

What is Global GaN Power IC Design Market?

The Global GaN Power IC Design Market is a rapidly evolving sector within the semiconductor industry, focusing on the development and application of Gallium Nitride (GaN) technology in power integrated circuits (ICs).

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in the Global GaN Power IC Design Market:

GaN is a wide-bandgap semiconductor material that offers significant advantages over traditional silicon-based semiconductors, including higher efficiency, faster switching speeds, and greater thermal stability.

GaN Power Devices, GaN RF Devices in the Global GaN Power IC Design Market:

These characteristics make GaN power ICs particularly attractive for a variety of applications, ranging from consumer electronics to industrial systems.

Global GaN Power IC Design Market Outlook:

The market is driven by the increasing demand for energy-efficient power solutions, as well as the growing adoption of electric vehicles and renewable energy systems.

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Report Metric	Details
Report Name	GaN Power IC Design Market
Accounted market size in year	US$ 2245 million
Forecasted market size in 2031	US$ 6005 million
CAGR	15.3%
Base Year	year
Forecasted years	2025 - 2031
Segment by Model	Power GaN IDM Power GaN Fabless
Segment by Application	GaN Power Devices GaN RF Devices
By Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Rest of Europe Nordic Countries Asia-Pacific (China, Japan, South Korea) Southeast Asia (India, Australia) Rest of Asia Latin America (Mexico, Brazil) Rest of Latin America Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company	Infineon (GaN Systems), STMicroelectronics, Texas Instruments, onsemi, Microchip Technology, Rohm, NXP Semiconductors, Toshiba, Innoscience, Wolfspeed, Inc, Renesas Electronics (Transphorm), Sumitomo Electric Device Innovations (SEDI) (SCIOCS), Alpha and Omega Semiconductor Limited (AOS), Nexperia, Epistar Corp., Qorvo, Navitas Semiconductor, Power Integrations, Inc., Efficient Power Conversion Corporation (EPC), MACOM, VisIC Technologies, Cambridge GaN Devices (CGD), Wise Integration, RFHIC Corporation, Ampleon, GaNext, Chengdu DanXi Technology, Southchip Semiconductor Technology, Panasonic, Toyoda Gosei, China Resources Microelectronics Limited, CorEnergy, Dynax Semiconductor, Sanan Optoelectronics, Hangzhou Silan Microelectronics, Guangdong ZIENER Technology, Nuvoton Technology Corporation, CETC 13, CETC 55, Qingdao Cohenius Microelectronics, Youjia Technology (Suzhou) Co., Ltd, Nanjing Xinkansen Technology, GaNPower, CloudSemi, Shenzhen Taigao Technology
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends