What is Global Multilayer Printed-wiring Board Market?
The Global Multilayer Printed-wiring Board Market refers to the worldwide industry involved in the production and distribution of multilayer printed-wiring boards (PWBs). These boards are essential components in various electronic devices, providing the necessary pathways for electrical currents to flow between different components. Multilayer PWBs consist of multiple layers of conductive material, typically copper, separated by insulating layers. This structure allows for more complex and compact circuit designs compared to single-layer or double-layer boards. The market encompasses a wide range of applications, including consumer electronics, communications, computer-related industries, and automotive sectors. The demand for multilayer PWBs is driven by the increasing complexity and miniaturization of electronic devices, as well as the growing adoption of advanced technologies such as 5G, IoT, and AI. The market is highly competitive, with numerous players striving to innovate and improve their products to meet the evolving needs of various industries.
Layer 4-6, Layer 8-10, Layer 10+ in the Global Multilayer Printed-wiring Board Market:
In the Global Multilayer Printed-wiring Board Market, different layers of PWBs are categorized based on the number of conductive layers they contain. Layer 4-6 PWBs are the most common type, accounting for a significant share of the market. These boards are typically used in consumer electronics, such as smartphones, tablets, and wearable devices, where moderate complexity and compact size are required. Layer 4-6 PWBs offer a good balance between performance and cost, making them suitable for a wide range of applications. On the other hand, Layer 8-10 PWBs are used in more complex electronic devices that require higher performance and greater functionality. These boards are often found in advanced communication equipment, high-end computing devices, and automotive electronics. The additional layers in these PWBs allow for more intricate circuit designs, enabling the integration of more components and features. Finally, Layer 10+ PWBs represent the most advanced and complex type of multilayer PWBs. These boards are used in highly sophisticated electronic systems, such as aerospace and defense applications, medical devices, and cutting-edge research equipment. The high number of layers in these PWBs allows for extremely dense and intricate circuit designs, supporting the most demanding performance requirements. The production of Layer 10+ PWBs involves advanced manufacturing techniques and stringent quality control measures to ensure reliability and performance. Overall, the different layers of PWBs cater to varying levels of complexity and performance requirements, supporting a wide range of applications across multiple industries.
Consumer Electronics, Communications, Computer Related Industry, Automotive Industry, Others in the Global Multilayer Printed-wiring Board Market:
The Global Multilayer Printed-wiring Board Market finds extensive usage across various sectors, including consumer electronics, communications, computer-related industries, automotive industry, and others. In the consumer electronics sector, multilayer PWBs are integral components in devices such as smartphones, tablets, laptops, and wearable gadgets. These boards enable the compact and efficient design of these devices, allowing for the integration of multiple functions and features in a small form factor. In the communications sector, multilayer PWBs are used in equipment such as routers, switches, and base stations. The increasing demand for high-speed data transmission and the rollout of 5G networks are driving the need for more advanced and reliable PWBs in this sector. In the computer-related industry, multilayer PWBs are used in servers, data centers, and high-performance computing systems. These boards support the complex and high-speed processing requirements of modern computing applications. In the automotive industry, multilayer PWBs are used in various electronic systems, including engine control units, infotainment systems, and advanced driver-assistance systems (ADAS). The growing trend towards electric and autonomous vehicles is further driving the demand for sophisticated PWBs in this sector. Additionally, multilayer PWBs are used in other industries such as aerospace, defense, medical devices, and industrial equipment. These boards support the advanced and reliable performance required in these critical applications. Overall, the versatility and performance of multilayer PWBs make them essential components in a wide range of electronic devices and systems across multiple industries.
Global Multilayer Printed-wiring Board Market Outlook:
The global Multilayer Printed-wiring Board market is anticipated to grow significantly, reaching an estimated value of US$ 36,350 million by 2030, up from US$ 30,440 million in 2024, with a compound annual growth rate (CAGR) of 3.0% during the period from 2024 to 2030. Key players in the global market include Tripod, Nippon Mektron, Zhen Ding Technology, Unimicron, and Shennan TPT, among others, collectively accounting for about 11% of the market. China stands out as the largest market for multilayer printed-wiring boards, holding a share of over 60%. The most prevalent product type within this market is the Layer 4-6 PWBs, which constitute more than 64% of the market share. The communications sector is the leading application area for these boards, representing over 31% of the market. This growth is driven by the increasing demand for advanced electronic devices and systems across various industries, as well as the continuous advancements in technology that require more complex and reliable PWBs.
| Report Metric | Details |
| Report Name | Multilayer Printed-wiring Board Market |
| Accounted market size in 2024 | an estimated US$ 30440 million |
| Forecasted market size in 2030 | US$ 36350 million |
| CAGR | 3.0% |
| Base Year | 2024 |
| Forecasted years | 2024 - 2030 |
| Segment by Type |
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| Segment by Application |
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| By Region |
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| By Company | Nippon Mektron, Zhen Ding Technology, Unimicron, Young Poong Group, SEMCO, Ibiden, Tripod, TTM Technologies, Sumitomo Electric SEI, Daeduck Group, Nan Ya PCB, Compeq, HannStar Board, LG Innotek, AT&S, Meiko, WUS, TPT, Chin-Poon, Shennan |
| Forecast units | USD million in value |
| Report coverage | Revenue and volume forecast, company share, competitive landscape, growth factors and trends |
