What is Global Online Solder Paste Inspection Market?
The Global Online Solder Paste Inspection Market is a dynamic and rapidly evolving sector that plays a crucial role in the electronics manufacturing industry. Solder paste inspection (SPI) is a process used in the assembly of printed circuit boards (PCBs) to ensure the quality and consistency of solder paste deposits. This process is critical in preventing defects and ensuring the reliability of the final product. The global market for online solder paste inspection is a significant part of the electronics manufacturing industry, with a value of US$ 1276.4 million in 2023. It is projected to reach US$ 1864.1 million by 2030, reflecting a compound annual growth rate (CAGR) of 6.3% during the forecast period from 2024 to 2030.

2D SPI, 3D SPI in the Global Online Solder Paste Inspection Market:
The Global Online Solder Paste Inspection Market is segmented into 2D SPI and 3D SPI. 2D SPI is a traditional method that measures the area and volume of solder paste deposits. It is widely used due to its simplicity and cost-effectiveness. On the other hand, 3D SPI is a more advanced method that provides a three-dimensional view of the solder paste deposits. It offers more accurate and detailed information, making it ideal for complex and high-density PCBs. The choice between 2D and 3D SPI depends on the specific requirements of the PCB assembly process. Both methods play a vital role in maintaining the quality and reliability of the final product.
FPD(LCD / OLED), PCB, Semiconductor, Others in the Global Online Solder Paste Inspection Market:
The Global Online Solder Paste Inspection Market finds its application in various areas such as FPD (LCD / OLED), PCB, Semiconductor, and others. In the FPD (LCD / OLED) industry, SPI is used to ensure the quality of solder paste deposits on the PCBs used in flat panel displays. In the PCB industry, SPI is an essential part of the assembly process, ensuring the reliability of the final product. In the semiconductor industry, SPI is used in the assembly of semiconductor devices to prevent defects and ensure high performance. Other applications of SPI include automotive electronics, aerospace electronics, and medical electronics, among others.
Global Online Solder Paste Inspection Market Outlook:
The future of the Global Online Solder Paste Inspection Market looks promising, with a steady growth rate projected for the coming years. In 2023, the market was valued at US$ 1276.4 million and is expected to reach US$ 1864.1 million by 2030, growing at a CAGR of 6.3% during the forecast period from 2024 to 2030. Similarly, the global semiconductor market, which was estimated at US$ 579 billion in 2022, is projected to grow to US$ 790 billion by 2029, with a CAGR of 6% during the forecast period. These figures indicate a positive trend for the online solder paste inspection market, driven by the increasing demand for high-quality and reliable electronic products.
| Report Metric | Details |
| Report Name | Online Solder Paste Inspection Market |
| Accounted market size in 2023 | US$ 1276.4 million |
| Forecasted market size in 2030 | US$ 1864.1 million |
| CAGR | 6.3% |
| Base Year | 2023 |
| Forecasted years | 2024 - 2030 |
| Segment by Type |
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| Segment by Application |
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| Production by Region |
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| Consumption by Region |
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| By Company | Test Research, Inc (TRI), MirTec Ltd, PARMI Corp, Viscom AG, ViTrox, Vi TECHNOLOGY, Mek (Marantz Electronics), CKD Corporation, Pemtron, SAKI Corporation, Machine Vision Products (MVP), Caltex Scientific, ASC International, Sinic-Tek Vision Technology, Jet Technology, Koh Young, CyberOptics Corporation, Omron |
| Forecast units | USD million in value |
| Report coverage | Revenue and volume forecast, company share, competitive landscape, growth factors and trends |