What is Global Chip Packaging Market?
The Global Chip Packaging Market is a vast and dynamic sector that plays a crucial role in the electronics industry. It involves the process of enclosing or packaging an electronic chip to protect it from physical damage and corrosion. This packaging also provides the necessary connections to the chip for it to interact with other devices. The market has seen significant growth due to the increasing demand for sophisticated and compact electronic devices. In 2019, the global chip package market was valued at a whopping $25007.3 million and is projected to reach $35419.2 million by 2026, growing at a compound annual growth rate (CAGR) of 6.72%. This growth is driven by the continuous advancements in technology and the increasing need for high-performance chips in various sectors.
Traditional Packaging, Advanced Packaging in the Global Chip Packaging Market:
The Global Chip Packaging Market is divided into two main categories: Traditional Packaging and Advanced Packaging. Traditional Packaging, which accounts for about 56% of the global market, involves the use of lead frames and wire bonding techniques to connect the chip to the package. On the other hand, Advanced Packaging, which occupies 45% of the market, uses sophisticated techniques like flip-chip and wafer-level packaging. These techniques offer better performance, higher reliability, and smaller form factors, making them ideal for modern electronic devices. The top 10 companies in this market now hold more than 78% of the total market share, indicating a high level of market concentration.
Automotive and Traffic, Consumer Electronics, Communication, Other in the Global Chip Packaging Market:
The Global Chip Packaging Market finds its applications in various sectors such as Automotive and Traffic, Consumer Electronics, Communication, and others. In the Automotive and Traffic sector, advanced chip packages are used in various systems like navigation, infotainment, and driver assistance systems. In the Consumer Electronics sector, they are used in devices like smartphones, laptops, and gaming consoles. In the Communication sector, they are used in networking equipment and communication devices. The use of advanced chip packages in these sectors helps in improving the performance, reliability, and form factor of the devices.
Global Chip Packaging Market Outlook:
The Global Chip Packaging Market outlook indicates a promising future. The market, which was valued at US$ 31150 million in 2023, is expected to reach US$ 48660 million by 2030, growing at a CAGR of 6.5% during the forecast period 2024-2030. This growth is driven by the continuous advancements in chip packaging technology and the increasing demand for high-performance chips in various sectors. The market is also characterized by a high level of concentration, with the top 10 companies holding more than 78% of the total market share. This indicates a high level of competition in the market, with companies constantly striving to innovate and improve their products to gain a competitive edge.
| Report Metric | Details |
| Report Name | Chip Packaging Market |
| Accounted market size in 2019 | $ 25,007.3 million |
| Forecasted market size in 2026 | $ 35,419.2 million |
| CAGR | 6.72 |
| Base Year | 2019 |
| Forecasted years | 2024 - 2026 |
| Segment by Type |
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| Segment by Application |
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| By Region |
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| By Company | ASE Group, Amkor Technology, JCET, Siliconware Precision Industries, Powertech Technology, TongFu Microelectronics, Tianshui Huatian Technology, UTAC, Chipbond Technology, Hana Micron, OSE, Walton Advanced Engineering, NEPES, Unisem, ChipMOS, Signetics, Carsem, King Yuan ELECTRONICS |
| Forecast units | USD million in value |
| Report coverage | Revenue and volume forecast, company share, competitive landscape, growth factors and trends |
