What is Global Fan-out Panel-level Packaging Market?
The Global Fan-out Panel-level Packaging Market is a rapidly evolving sector in the semiconductor industry. This technology is a type of semiconductor packaging that involves the redistribution of the input/output (I/O) from the perimeter of a device to the entire area of the device. This allows for a higher number of I/Os and a smaller package size, which is beneficial for devices that require high performance and compact size. The market for this technology is growing due to the increasing demand for advanced electronic devices such as smartphones, tablets, and wearable devices. The technology is also being adopted in the automotive and medical industries due to its ability to improve the performance and reliability of electronic devices.
System-in-package (SiP), Heterogeneous Integration in the Global Fan-out Panel-level Packaging Market:
The System-in-package (SiP) and Heterogeneous Integration are key components of the Global Fan-out Panel-level Packaging Market. SiP is a process of integrating multiple integrated circuits (ICs) into a single package, which allows for a higher level of integration and improved performance. Heterogeneous Integration, on the other hand, involves the integration of different types of materials and devices into a single system. This can include the integration of different types of semiconductors, passive components, and other electronic components. These technologies are driving the growth of the Global Fan-out Panel-level Packaging Market as they allow for the development of more advanced and compact electronic devices.
Wireless Devices, Power Management Units, Radar Devices, Processing Units, Others in the Global Fan-out Panel-level Packaging Market:
The Global Fan-out Panel-level Packaging Market is being used in a variety of areas including Wireless Devices, Power Management Units, Radar Devices, Processing Units, and others. In Wireless Devices, this technology is used to improve the performance and reliability of the devices. In Power Management Units, it is used to increase the efficiency and reduce the size of the units. In Radar Devices, it is used to enhance the accuracy and range of the radar. In Processing Units, it is used to increase the processing speed and reduce the power consumption. The use of this technology in these areas is driving the growth of the Global Fan-out Panel-level Packaging Market.
Global Fan-out Panel-level Packaging Market Outlook:
Looking at the market outlook, the Global Fan-out Panel-level Packaging Market was valued at a significant US$ 1369.8 million in 2023. The market is expected to witness a substantial growth, reaching a whopping US$ 4907.9 million by 2030. This indicates a Compound Annual Growth Rate (CAGR) of 19.7% during the forecast period from 2024 to 2030. In parallel, the global market for semiconductors, which was estimated at US$ 579 billion in 2022, is projected to reach US$ 790 billion by 2029. This represents a CAGR of 6% during the forecast period. The growth in both these markets signifies the increasing demand and adoption of advanced semiconductor technologies.
| Report Metric | Details |
| Report Name | Fan-out Panel-level Packaging Market |
| Accounted market size in 2023 | US$ 1369.8 million |
| Forecasted market size in 2030 | US$ 4907.9 million |
| CAGR | 19.7% |
| Base Year | 2023 |
| Forecasted years | 2024 - 2030 |
| Segment by Type |
|
| Segment by Application |
|
| By Region |
|
| By Company | Amkor Technology, Deca Technologies, Lam Research Corporation, Qualcomm Technologies, Siliconware Precision Industries, SPTS Technologies, STATS ChipPAC, Samsung, TSMC |
| Forecast units | USD million in value |
| Report coverage | Revenue and volume forecast, company share, competitive landscape, growth factors and trends |
