What is Global Epoxy Molding Compounds Market?
The Global Epoxy Molding Compounds Market is a vast and dynamic sector that encompasses a variety of compounds used in a multitude of applications. These compounds are primarily used in the electronics industry, where they serve as protective coatings for semiconductors. Epoxy molding compounds are known for their excellent electrical properties, high heat resistance, and superior mechanical strength, making them ideal for use in high-performance applications. The global market for these compounds is driven by the increasing demand for advanced electronics and the ongoing miniaturization of electronic components. However, the market's growth is also influenced by factors such as the cost of raw materials and the environmental impact of epoxy resin production.
Solid EMC, Liquid EMC in the Global Epoxy Molding Compounds Market:
The Global Epoxy Molding Compounds Market is divided into two main categories: Solid EMC and Liquid EMC. Solid EMC is the most widely used type, accounting for approximately 80% of the market. These compounds are typically used in applications that require high heat resistance and excellent electrical properties, such as integrated circuits and power semiconductors. On the other hand, Liquid EMC is used in applications that require a lower viscosity and a longer pot life. Despite their differences, both types of EMC offer excellent performance and reliability, making them indispensable in the electronics industry.
Memory, Non-memory, Discrete, Power Module in the Global Epoxy Molding Compounds Market:
The Global Epoxy Molding Compounds Market finds its usage in various areas such as Memory, Non-memory, Discrete, and Power Module. In the Memory sector, EMCs are used to protect memory chips from physical and environmental damage. In the Non-memory sector, they are used in the production of microprocessors and other non-memory semiconductors. In the Discrete sector, EMCs are used in the production of individual electronic components such as diodes and transistors. Lastly, in the Power Module sector, EMCs are used to encapsulate power semiconductors, providing them with the necessary heat resistance and electrical insulation.
Global Epoxy Molding Compounds Market Outlook:
The Global Epoxy Molding Compounds Market is a thriving sector with a promising future. As of 2022, the market was valued at US$ 2178 million and is expected to reach US$ 3059 million by 2029, growing at a CAGR of 4.5% during the forecast period 2023-2029. The largest share of the market is held by Asia-Pacific, accounting for about 86% of the total market. North America follows with a market share of about 6%. The leading producers in the industry are Sumitomo Bakelite, Showa Denko, and Chang Chun Group, which accounted for 20%, 10%, and 4% of the revenue respectively. The largest segment in terms of product is solid EMC, which holds a share of about 80%.
| Report Metric | Details |
| Report Name | Epoxy Molding Compounds Market |
| Accounted market size in 2022 | US$ 2178 in million |
| Forecasted market size in 2029 | US$ 3059 million |
| CAGR | 4.5% |
| Base Year | 2022 |
| Forecasted years | 2023 - 2029 |
| Segment by Type |
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| Segment by Application |
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| Production by Region |
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| Consumption by Region |
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| By Company | Sumitomo Bakelite, Showa Denko, Chang Chun Group, Hysol Huawei Electronics, Panasonic, Kyocera, KCC, Samsung SDI, Eternal Materials, Jiangsu zhongpeng new material, Shin-Etsu Chemical, Nagase ChemteX Corporation, Tianjin Kaihua Insulating Material, HHCK, Scienchem, Beijing Sino-tech Electronic Material |
| Forecast units | USD million in value |
| Report coverage | Revenue and volume forecast, company share, competitive landscape, growth factors and trends |
