What is Global Die Bonder Equipment Market?
The Global Die Bonder Equipment Market is a specialized sector within the broader electronics and semiconductor industry. It refers to the global market for machines that are used in the process of attaching a die, or a small block of semiconducting material, onto a substrate or package. Die bonders play a crucial role in the manufacturing of integrated circuits, which are a key component in virtually all electronic devices. The die bonder equipment market is a global one, with key players and consumers spread across the world. The market includes various types of die bonders, such as manual, semi-automatic, and fully automatic, each with its own set of advantages and applications. The market's value is determined by the demand for these machines, which in turn is influenced by factors such as the growth of the electronics industry, technological advancements, and the level of investment in semiconductor manufacturing infrastructure.
Fully Automatic Die Bonder, Semi-Automatic Die Bonder, Manual Die Bonder in the Global Die Bonder Equipment Market:
The Global Die Bonder Equipment Market is segmented based on the type of equipment into Fully Automatic Die Bonder, Semi-Automatic Die Bonder, and Manual Die Bonder. Fully Automatic Die Bonders are highly efficient machines that can operate without human intervention, making them ideal for high-volume manufacturing environments. They are capable of performing complex tasks with high precision and consistency, which is crucial in the production of advanced integrated circuits. Semi-Automatic Die Bonders, on the other hand, require some level of human intervention. They are typically used in situations where the production volume is lower, or where the bonding process involves tasks that cannot be fully automated. Manual Die Bonders are the simplest and least expensive type of die bonder. They are typically used for low-volume or prototype production, or for tasks that require a high level of flexibility and adaptability. Each type of die bonder has its own set of advantages and disadvantages, and the choice between them depends on factors such as the production volume, the complexity of the tasks, and the available budget.
Integrated Device Manufacturers (IDMs), Outsourced Semiconductor Assembly and Test (OSAT) in the Global Die Bonder Equipment Market:
The Global Die Bonder Equipment Market finds its usage in various areas such as Integrated Device Manufacturers (IDMs) and Outsourced Semiconductor Assembly and Test (OSAT). IDMs are companies that design, manufacture, and sell their own electronic devices. They have their own in-house semiconductor fabrication facilities, where they use die bonders to produce their integrated circuits. OSAT companies, on the other hand, provide semiconductor assembly and testing services to other companies. They use die bonders to assemble the semiconductors that they receive from their clients. The demand for die bonder equipment in these areas is influenced by factors such as the level of investment in semiconductor manufacturing infrastructure, the growth of the electronics industry, and the technological advancements in the field of integrated circuits.
Global Die Bonder Equipment Market Outlook:
The Global Die Bonder Equipment Market outlook is positive, with a steady growth expected in the coming years. In 2022, the market was valued at US$ 790.9 million, and it is projected to reach US$ 942.9 million by 2029. This represents a compound annual growth rate (CAGR) of 2.5% during the forecast period from 2023 to 2029. Europe is a major player in this market, accounting for more than 32% of the total output. The leading manufacturer in the global Die Bonder Equipment market is Besi, which holds a market share of 39% in terms of revenue. These figures indicate a healthy and competitive market, with plenty of opportunities for both existing players and new entrants.
| Report Metric | Details |
| Report Name | Die Bonder Equipment Market |
| Accounted market size in 2023 | US$ 790.9 million |
| Forecasted market size in 2030 | US$ 942.9 million |
| CAGR | 2.5% |
| Base Year | 2023 |
| Forecasted years | 2024 - 2030 |
| Segment by Type |
|
| Segment by Application |
|
| Production by Region |
|
| Consumption by Region |
|
| By Company | Besi, ASM Pacific Technology(ASMPT), Kulicke & Soffa, Palomar Technologies, Shinkawa, DIAS Automation, Toray Engineering, Panasonic, FASFORD TECHNOLOGY, West-Bond, Hybond |
| Forecast units | USD million in value |
| Report coverage | Revenue and volume forecast, company share, competitive landscape, growth factors and trends |
