What is Global Back Grinding Tapes (BGT) Market?
The Global Back Grinding Tapes (BGT) Market is a specialized sector within the broader semiconductor industry. Back Grinding Tapes, also known as BGT, are used in the process of manufacturing semiconductors. These tapes are applied to the backside of the wafer during the back grinding process to prevent damage to the front side of the wafer. The tape also prevents contamination of the grinding and cutting equipment. The global BGT market is a crucial part of the semiconductor manufacturing process, as it ensures the quality and integrity of the final product. The market for these tapes is driven by the increasing demand for semiconductors in various industries such as electronics, automotive, and telecommunications. The BGT market is also influenced by technological advancements in semiconductor manufacturing processes and the increasing need for miniaturization of electronic devices. However, the market faces challenges such as the high cost of these tapes and the need for skilled labor for their application. Despite these challenges, the global BGT market is expected to grow in the coming years due to the increasing demand for semiconductors and the continuous advancements in semiconductor manufacturing technologies.
UV Type, Non-UV Type in the Global Back Grinding Tapes (BGT) Market:
The Global Back Grinding Tapes (BGT) Market is segmented into UV Type and Non-UV Type based on the type of adhesive used in the tapes. UV Type BGT uses an adhesive that can be cured by ultraviolet light. This type of tape is used in applications where high adhesion strength is required. The UV Type BGT is also used in applications where the tape needs to be removed cleanly without leaving any residue. On the other hand, Non-UV Type BGT uses a pressure-sensitive adhesive that does not require UV light for curing. This type of tape is used in applications where the tape needs to be removed easily after the back grinding process. Both types of tapes have their own advantages and disadvantages, and their usage depends on the specific requirements of the semiconductor manufacturing process. The choice between UV Type and Non-UV Type BGT also depends on factors such as the type of wafer material, the thickness of the wafer, and the back grinding equipment used.
Standard, Standard Thin Die, (S)DBG (GAL), Bump in the Global Back Grinding Tapes (BGT) Market:
The Global Back Grinding Tapes (BGT) Market finds its usage in various areas such as Standard, Standard Thin Die, (S)DBG (GAL), and Bump. In the Standard area, BGT is used in the standard back grinding process where the wafer is ground to a standard thickness. In the Standard Thin Die area, BGT is used in the back grinding process where the wafer is ground to a thinner thickness than the standard thickness. This is done to manufacture thin die semiconductors which are used in applications where space is a constraint. In the (S)DBG (GAL) area, BGT is used in the Semi-Die-Back Grinding (SDBG) process and the Grinding-After-Lamination (GAL) process. In the Bump area, BGT is used in the process of manufacturing bumped wafers. Bumped wafers are used in flip-chip packaging, which is a method of connecting the die to the package. The usage of BGT in these areas is crucial for the quality and integrity of the final semiconductor product.
Global Back Grinding Tapes (BGT) Market Outlook:
The Global Back Grinding Tapes (BGT) Market is a dynamic and competitive market. As of 2022, the market was valued at US$ 187.7 million and is projected to reach US$ 259.9 million by 2029, growing at a CAGR of 4.9% from 2023 to 2029. The market is dominated by five major manufacturers, namely Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, and Denka. These manufacturers collectively hold more than 85% of the market share. Mitsui Chemicals Tohcello is the largest producer, holding more than 30% of the market share. Japan is the leading region in the production of back grinding tapes, accounting for more than 40% of the market share. In terms of application, bump holds about 50% of the market share. The market dynamics are influenced by various factors such as technological advancements, demand for semiconductors, and the strategies of the key players in the market.
| Report Metric | Details |
| Report Name | Back Grinding Tapes (BGT) Market |
| Accounted market size in 2023 | US$ 195 million |
| Forecasted market size in 2029 | US$ 259.9 million |
| CAGR | 4.9 |
| Base Year | 2023 |
| Forecasted years | 2023 - 2029 |
| Segment by Type |
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| Segment by Application |
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| Production by Region |
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| Sales by Region |
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| By Company | Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka, D&X, AI Technology |
| Forecast units | USD million in value |
| Report coverage | Revenue and volume forecast, company share, competitive landscape, growth factors and trends |
